Keep your CPU cool and running smoothly with JunPus JP-CL1 TIM Cleaning Wipes - the perfect solution for removing thermal paste and dirt from your components.
JunPus JP-CL1 TIM Cleaning Wipes offer a professional-grade cleaning solution for your computer components, helping to improve thermal performance and longevity.
Don't let dirt and grime impede your CPU's performance - JunPus JP-CL1 TIM Cleaning Wipes make it easy to clean and maintain your thermal paste for optimal heat dissipation.
specially designed to clean thermal paste and other residues that can impact your CPU's cooling ability.
JP-Dx1 Made with high-purity thermal conducting materials, JP-Dx1 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.
This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.
JP-DL800B Made with high-purity thermal conducting materials, JP-DL800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.
This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.
JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.